Description
The ZLYY High-Performance 2U Drawer Rack Server is engineered to deliver exceptional compute density and reliability for modern data centers and cloud environments. Its innovative tool-less pull-out drawer design provides unparalleled serviceability, allowing quick and easy access to all critical components—including motherboards, power supplies, and storage—for simplified maintenance and upgrades. At its core, the server supports dual high-performance processors, substantial DDR4 memory expansion, and flexible storage configurations with multiple drive bays. The integrated dual hot-swappable fan modules ensure efficient and redundant thermal management, maintaining optimal operating temperatures even under heavy loads. Built for scalability and efficiency, this server is a robust foundation for virtualization, high-performance computing (HPC), and mission-critical enterprise applications.
Specification of 2U Drawer Rack Server
| Category | Specification |
|---|---|
| Model | ZLYY-2U-Drawer-Server |
| Form Factor | 2U Rackmount, Pull-Out Drawer Design |
| Processor Support | Dual Socket (e.g., Intel® Xeon® Scalable or AMD EPYC™ series) |
| Memory | Multiple DDR4 RDIMM/LRDIMM slots (e.g., 16/24 slots), High Capacity Support |
| Storage | Multiple 2.5″/3.5″ Hot-swappable Drive Bays (SATA/SAS/NVMe support) |
| Expansion | Several PCIe Expansion Slots (low-profile) |
| Cooling | Dual Hot-swappable Fan Modules, N+1 Redundancy |
| Power Supply | Dual Hot-swappable Redundant Power Supplies (e.g., 800W/1200W Platinum) |
| Management | Dedicated Management Port (IPMI 2.0 with KVM-over-IP) |
| Network | Dual or Quad Gigabit/10GbE LAN Ports (onboard) |
| Front Interface | USB Ports, VGA, System Status Indicators |
Features of 2U Drawer Rack Server
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Tool-Less Serviceability: The unique pull-out drawer chassis allows the entire server node to be easily slid out from the front of the rack, providing direct access to all internal components for rapid deployment, maintenance, and upgrades without requiring rear access.
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Advanced Redundant Cooling: Equipped with dual, independently controlled hot-swappable fan modules. This N+1 or N+N redundancy ensures continuous, efficient airflow to cool high-power components, preventing thermal throttling and enhancing system reliability.
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High-Density Compute Design: Packing dual high-core-count processors, massive memory capacity, and flexible high-speed storage into a compact 2U form factor, it maximizes compute performance per rack unit, perfect for virtualization and consolidated workloads.
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Enterprise-Grade Reliability: Built with premium components, redundant hot-swappable power supplies, and ECC memory support to ensure data integrity and provide uninterrupted operation for 24/7 mission-critical applications in data centers.
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Intelligent Remote Management: Features an integrated BMC with IPMI 2.0 and KVM-over-IP support, enabling comprehensive out-of-band remote monitoring, management, and troubleshooting, which reduces the need for physical presence and lowers operational costs.
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